VLSI Device Operation, Physics and Technology

• Effects of Technology Scaling on VLSI Devices and Basic Review
• MOS Devices and Process Optimization

MOS Capacitors and Processing
Flatband and Threshold Voltage
Non-ideal MOS Capacitors and Effects of Oxidation Process
Effects of Gate Oxide Process on Oxide Integrity
MOS Characterization Techniques
• MOSFET Scaling Effects and Process Solutions

Subthreshold Characteristics
Effective Mobility and Velocity Saturation Effects
Short-Channel and Narrow Channel Effects
Reverse Short-Channel and Reverse Narrow Channel Effects
Temperature Dependence and Process Optimization
Drain-Induced Barrier Lowering (DIBL) and Punchthrough
Hot-Carrier Effects and LDD Devices
Gate-Induced Drain Leakage (GIDL)
CMOS Latchup and Process Solution
• Bipolar Junction Transistors

BiCMOS structures
BJT operation and Gain Parameters
High-level and Low-level Injection Effects
Early Effects, Base Resistance Effects and Breakdown Voltages